The Australian Institute of Packaging (AIP) Australasian Packaging Conference and the Australasian Packaging Innovation & Design (PIDA) Awards will be held in person on 28th – 29th March 2023 in Melbourne.
This will be the first time since the pandemic that the AIP has been able to run the two important industry events in real life. be celebrating its 60th anniversary in 2023.
The 2023 AIP Australasian Packaging Conference will be held at the Crown Promenade, Melbourne and will be designed to deliver a two-day educational program that will cover a broad range of topics relating to the theme 2025 & BEYOND.
During the two-day event, the AIP will also be running the 2023 Australasian Packaging Innovation & Design (PIDA) Awards as the gala dinner on the 28th of March.
The conference will look at how the various industries are heading towards the 2025 National Packaging Targets and will cover topics such as refusal, reduction, reuse, recycling, and circularity.
The speakers will also look at what is beyond 2025 and what the industry needs to do to design out waste, eliminate problematic materials, reduce single-use plastic and ensure that we are capable of collecting, sorting, recovering and recycling all the materials and packaging formats in Australia and New Zealand.
Hear from lead experts in all areas of the waste hierarchy and maybe the opportunity to network with like-minded professionals who are working towards, and beyond 2025.
The 2023 AIP Australasian Packaging Conference 2025 & BEYOND will attract delegates from all facets of food, beverage, pharmaceutical, manufacturing and packaging industries including packaging technologists, designers and engineers, sustainability managers, marketing, sales, production, design agencies to equipment suppliers, raw material providers, users of packaging, retailers and consumers, environmental managers, procurement, quality teams, government & councils and waste and recycling companies.
The whole of industry is invited to attend this important conference and be a part of the discussion.
Register your interest using the following link.