The Australian Institute of Packaging’s ‘Packaging and Innovation Excellence’ annual conference took place last week and was inclusive of a number of special announcements including the launch of the pilot Ignite Packaging mentoring program for women.
The program is designed for women working in the food, beverage, manufacturing and packaging industries and aims to transform participants professionally and personally. The program enables participants to master new skills and techniques over a 12 week period and is inclusive of fortnightly webinars featuring guest speakers from within the industry.
According to the AIP, the program provides organisations with a powerful employee brand and employee benefit tool by helping them attract and retain females in their workforce. Applications close on 25 July.
In addition to the launch of the Ignite Program, fellowships and scholarships were also announced during the AIP conference dinner on Tuesday 17 June.
Both Ralph Moyle and Craig Wellman were awarded the grade of fellow in recognition of a significant and sustained contribution to the technology, science or application of packaging within the industry.
Ralph Moyle, packaging development officer, Simplot Australia and national president of the AIP, was recognised for the significant contribution he has made to the packaging industry over the last 40 years.
Ralph Moyle’s role in many significant and innovative Shelf-Friendly Packaging developments that are currently in-stores around Australia and New Zealand are one of the key contributors to this recognition.
Craig Wellman, chief executive officer, Wellman Packaging, was awarded for demonstrating innovative packaging leadership in the area of plastics technology and injection moulded closures over the last two decades. Wellman holds a number of patents as an inventor, especially in the area of injection moulded closures.
The winner of the APPMA sixth annual scholarship program was also announced during the conference dinner.
Mark Dingley, chairman of the APPMA presented the scholarship to Aleah Back, Packaging Engineer, Johnson and Johnson Pacific. The scholarship enables Back to study a Diploma in Packaging Technology.
“Aleah is an ideal candidate for the scholarship as she has shown a huge interest and commitment in undertaking the Diploma in Packaging Technology. She has both academic and practical expertise in the industry and is keen to expand her Technical Education in the Packaging Industry,” said Dingley.
“Aleah not only has an interest in packaging but also the engineering process and she has had the opportunity to learn about injection technology, in-mould labelling and advanced robotic production systems. Aleah will commence her Diploma in Packaging Technology this year and we look forward to seeing her graduate.”