Packaging Technology scholarship applications close 11 April

The closing date is approaching for a $9000 scholarship for a packing engineer to complete a Diploma in Packaging Technology.

The Australian Packaging and Processing Machinery Association (APPMA), in conjunction with the Australian Institute of Packaging (AIP) are offering the scholarship their sixth year.

The diploma is an internationally recognised level 5 foundation degree qualification that aims to prepare students for packaging operations at any level through the supply chain.

 Chairman of the APPMA Mark Dingley says the scholarship is a unique opportunity for a packing engineer to further their education in the packaging industry.

 “The APPMA has been offering this educational program now for six years and we have been very pleased with the calibre of winners; all of whom are busy completing their Diplomas as we speak,” Mr Dingley said.

Jamie Schellebeck, who was 2013 scholarship winner, is a Packaging Engineer at Amcor Fibre Packaging.

“Winning the scholarship in 2013 was a wonderful opportunity for me and I am eager to gain more technical expertise in the packaging industry by undertaking the Diploma in Packaging Technology. I look forward to graduating from the course in a few years.” Mr Schelleback said.

To download an application form, visit the APPMA or AIP website.

Submissions close on 11 April.


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